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IL388DAA
Vishay Semiconductors
Linear Optocoupler, PCMCIA package
Features
* 2.3 mm High SMD package * High sensitivity (K1) at low operating LED RoHS COMPLIANT current * Couples AC and DC signals e3 * Low input-output capacitance * Isolation test voltage, 2130 VDC * Low distortion, below - 80 db (typical) * 0.4 mm internal insulation thickness * Lead-free component * Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC
K1 A2 B1 3 C1 4 K1 K2 8 C2 7 B2 6 N.C 5 N.C
i179085
Agency Approvals
* CSA 93751
Applications
* Optical DAA for V.90 FAX/Modem * PCMCIA cards * Digital telephone line isolation
ambient temperature changes. Thus one can control the output diode current optically by controlling the input photodiode current. The IL388DAA is designed to be part of the DAA2000 kit which consists of one DL207DAA, one DM207DAA, and two IL388DAAs. The DL207DAA and DM207DAA ICs provide the drivers and receivers for the IL388DAA as well as all other telephone termination functions.
Description
The IL388DAA Linear Optocoupler consist of an IRLED optically coupled to two photodiodes. The emitter is located such that both photodiodes receive approximately an equal amount of infrared light. The diodes produce a proportional amount of photocurrent. The ratio of the photocurrent stays constant with high accuracy when either the LED current or the
Order Information
Part IL388DAA Remarks Couples AC and DC signals, SOP-8
For additional information on the available options refer to Option Information.
Absolute Maximum Ratings
Tamb = 25 C, unless otherwise specified Stresses in excess of the absolute Maximum Ratings can cause permanent damage to the device. Functional operation of the device is not implied at these or any other conditions in excess of those given in the operational sections of this document. Exposure to absolute Maximum Rating for extended periods of the time can adversely affect reliability.
Input
Parameter Reverse voltage Forward current Surge current pulse width < 10 s Power dissipation Derate linearly from 25 C Junction temperature Tj Test condition Symbol VR IF IPK Pdiss Value 3.0 30 150 150 2.0 100 Unit V mA mA mW mW/C C
Document Number 83723 Rev. 1.4, 11-Aug-06
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IL388DAA
Vishay Semiconductors
Output
Parameter Reverse voltage Power dissipation Derate linearly from 25 C Junction temperature Tj Test condition Symbol VR Pdiss Value 15 50 0.65 100 Unit V mW mW/C C
Coupler
Parameter Isolation test voltage Total package power dissipation Derate linearly from 25 C Storage temperature Operating temperature Lead soldering time at 260 C Isolation resistance VIO = 500, Tamb = 25 C VIO = 500, Tamb = 100 C RIO RIO Tstg Tamb Test condition Symbol VISO Pt Value 2130 250 2.8 - 40 to + 150 0 to + 75 10 1012 1011 Unit VDC mW mW/C C C s
Electrical Characteristics
Tamb = 25 C, unless otherwise specified Minimum and maximum values are testing requirements. Typical values are characteristics of the device and are the result of engineering evaluation. Typical values are for information only and are not part of the testing requirements.
Input
Parameter Forward voltage Reverse current VF temperature coefficient Junction capacitance Dynamic resistance VF = 0 V, f = 1.0 MHz Test condition IF = 10 mA VR = 3.0 V Symbol VF IR VF/ C Cj VF/IF Min Typ. 1.8 0.01 TBD 15 6.0 Max 2.1 10 Unit V A mV/C pF
Output
Parameter Junction capacitance AC Characteristics photovoltaic mode Frequency response Phase response Rise time IP1 = 25 A Modulation current IP1 = 6.0 A IP1 = 25 A Modulation current IP1 = 6.0 A IP1 = 25 A Modulation current IP1 = 6.0 A tr BW (-3 db) 1.0 45 350 MHz Deg. ns Test condition VF = 0 V, f = 1.0 MHz Symbol Cj Min Typ. 12 Max Unit pF
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Document Number 83723 Rev. 1.4, 11-Aug-06
IL388DAA
Vishay Semiconductors Coupler
Parameter Capacitance (input-output) Common mode capacitance Coupled characteristics K1 THD K3 = K2/K1 IF = 2.0 mA, VD = 0 V f0 = 316, IPI = 35 A, VD = 0 V IF = 2.0 mA, VD = 0 V 0.70 K1 0.007 - 79 1.30 db Test condition VF = 0 V, f = 1.0 MHz VF = 0 V, f = 1.0 MHz Symbol CIO CCM Min Typ. 1.0 0.5 Max Unit pF pF
Package Dimensions in Inches (mm)
R 0.010 (0.25)
0.336 (8.4) 0.225 (5.7) 0.215 (5.5) 0.010 ( 0.25)
0.050 (1.27)
0.014 (0.36) 0.036 (0.91) 0.266 (6.76) 0.356 (9.04) 0.045 (1.14)
Pin One ID
0.230 (5.8) 0.220 (5.6)
0.291 (7.28) 0.010 (0.250) 0.015 (0.38) 0.002 (0.05)
ISO Method A
0.042 (1.05) Ref. 0.091 (2.3) 0.083 (2.1) 0.043 (1.09) 0.033 (0.83) 0.050 (1.25) typ. 0.016 (0.41) typ.
0.047 (1.19) 0.002 (0.05) 40
10 typ. 0.006 (0.15) typ. 3 - 7
i178013
Document Number 83723 Rev. 1.4, 11-Aug-06
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IL388DAA
Vishay Semiconductors Ozone Depleting Substances Policy Statement
It is the policy of Vishay Semiconductor GmbH to 1. Meet all present and future national and international statutory requirements. 2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment. It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances (ODSs). The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances. Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents. 1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively 2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental Protection Agency (EPA) in the USA 3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively. Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances.
We reserve the right to make changes to improve technical design and may do so without further notice. Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use Vishay Semiconductors products for any unintended or unauthorized application, the buyer shall indemnify Vishay Semiconductors against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use. Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany
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Document Number 83723 Rev. 1.4, 11-Aug-06
Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, "Vishay"), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product. Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay's terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000 Revision: 18-Jul-08
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